Concepedia

Gerald Mittendorfer

GM

Statistics

Publications

4

Citations

146

H-Index

4

Active since

2003

Affiliations

EV Group (Austria)(Current)

Gerald Mittendorfer is an author at EV Group (Austria) specializing in applied physics, electronic packaging, and microfabrication.

Top concepts

EngineeringApplied PhysicsMicroelectronicsMicrofabricationElectronic PackagingMaterial ScienceMaterials EngineeringElectrical EngineeringCorrosion3D Integration

Publications per year

2003–2012

4

Publications

4

Adhesive wafer bonding for MEMS applications

Viorel Drăgoi, T. Glinsner, Gerald Mittendorfer et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2003 · 50 citations

Engineering, Dow Chemicals, Low Temperature +16

Wafer-level plasma activated bonding: new technology for MEMS fabrication

Viorel Drăgoi, Gerald Mittendorfer, Christine Thanner et al. · Microsystem Technologies · 2007 · 39 citations

Materials Science, Wafer-level Plasma, Engineering +7

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Viorel Drăgoi, Eric Pabo, Jürgen Burggraf et al. · Microsystem Technologies · 2012 · 33 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +10

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Viorel Drăgoi, Gerald Mittendorfer, Jürgen Burggraf et al. · ECS Transactions · 2010 · 24 citations

Aluminium Nitride, Engineering, Wafer Scale Processing +17

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