CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Gold-indium Transient Liquid Phase (TLP) wafer bonding for MEMS vacuum packaging

Warren C. Welch, Khalil Najafi · Proceedings, IEEE micro electro mechanical systems · 2008 · 57 citations

Engineering, Electrical Engineering, Materials Science +12

Room temperature metal direct bonding

Qiaoling Tong · Applied Physics Letters · 2006 · 49 citations

Engineering, Materials Engineering, Materials Science +17

Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Viorel Drăgoi, Gerald Mittendorfer, Jürgen Burggraf et al. · ECS Transactions · 2010 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +16

3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces

Jian-Qiang Lü, J. J. McMahon, R.J. Gutmann · MRS Proceedings · 2008 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +14

Dielectric GlueWafer Bonding For 3D ICs

Yongchai Kwon, Akiya Jinda, J. J. McMahon et al. · MRS Proceedings · 2003 · 17 citations

Engineering, Materials Engineering, Materials Science +10