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3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces

Materials ScienceIntegration Using Adhesive3D Ic ArchitectureWafer Scale ProcessingEngineeringDevice IntegrationAdvanced Packaging (Semiconductors)MicrofabricationWafer Bonding InterfacesMechanical EngineeringApplied Physics3D IntegrationChip AttachmentElectronic PackagingMicroelectronics3D Printing