3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces

Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

Robert Patti · Proceedings of the IEEE · 2006 · 595 citations

Engineering, Computer Engineering, Electrical Engineering +14

Adhesive wafer bonding

Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics · 2006 · 463 citations

Engineering, Materials Engineering, Materials Science +17

3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

Jian‐Qiang Lu · Proceedings of the IEEE · 2009 · 313 citations

Engineering, Manufacturing Engineering, Materials Science +17

A wafer-scale 3-D circuit integration technology

J.A. Burns, Brian F. Aull, C.K. Chen et al. · IEEE Transactions on Electron Devices · 2006 · 269 citations

Engineering, Electrical Engineering, Analog Electronics +16

Three-dimensional wafer stacking via Cu-Cu bonding integrated with 65-nm strained-Si/low-k CMOS technology

P. Morrow, Choon-Ho Park, Shriram Ramanathan et al. · IEEE Electron Device Letters · 2006 · 167 citations

Engineering, Computer Engineering, Electrical Engineering +17