R.J. Gutmann

Adhesive wafer bonding

Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics · 2006 · 463 citations

Engineering, Materials Engineering, Materials Science +17

Advanced multilayer metallization schemes with copper as interconnection metal

S. P. Murarka, R.J. Gutmann, Alain E. Kaloyeros et al. · Thin Solid Films · 1993 · 246 citations

Natural Sciences, Materials Engineering, Materials Science +12

Chemical processes in the chemical mechanical polishing of copper

Joseph M. Steigerwald, S. P. Murarka, R.J. Gutmann et al. · Materials Chemistry and Physics · 1995 · 197 citations

Engineering, Materials Engineering, Materials Science +14

Analytical modeling and experimental evaluation of interconnect parasitic inductance on MOSFET switching characteristics

Ying Xiao, T. Paul Chow, R.J. Gutmann · 2004 · 166 citations

Engineering, Electrical Engineering, Circuit Theory +16

Recombination processes in doubly capped antimonide-based quaternary thin films

Sudesh Saroop, J.M. Borrego, R.J. Gutmann et al. · Journal of Applied Physics · 1999 · 164 citations

Engineering, Materials Engineering, Materials Science +17