J. J. McMahon - Concepedia

Author

J. J. McMahon

Rensselaer Polytechnic Institute

Also Known As

J. J. MCMAHON, J. J. McMahon, J. Jay McMahon, J.J. McMahon, J. J. McMahon, Jay McMahon

Publications

683

Citations

H-Index

Concepts

All Affiliations

Rensselaer Polytechnic Institute Argonne National Laboratory

About

J. J. McMahon is an author at Rensselaer Polytechnic Institute specializing in engineering, microelectronics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	18	459
2	Applied Physics	10	11	313
3	Natural Sciences	3	3	45
4	Business	1	1	145
5	Chemical Engineering	1	1	13

J. J. McMahon

Publications

610

Citations

H-Index

Page 1

	Year	Citations
Viscoplasticity based on overstress with a differential growth law for the equilibrium stress E. Krempl, J. J. McMahon, D. Yao Mechanics of Materials Equilibrium StressEconomicsViscoplastic FluidDifferential Growth LawMacroeconomics	1986	145
Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration Frank Niklaus, Ravi Kumar, J. J. McMahon, Journal of The Electrochemical Society EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2006	80
Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect J. J. McMahon, Jian‐Qiang Lu, R.J. Gutmann EngineeringIntegration Technology PlatformMechanical EngineeringInterconnect (Integrated Circuits)Wafer Scale Processing	2005	54
Passive microfluidic device for submillisecond mixing Zonghuan Lu, J. J. McMahon, Hisham Mohamed, Sensors and Actuators B Chemical EngineeringFluid MechanicsPassive Microfluidic DeviceLab-on-a-chipMicroscale System	2009	53
Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs Jian‐Qiang Lu, Anurag Jindal, Yongchai Kwon, EngineeringEvaluation ProceduresInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2004	40
Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform Scott Pozder, Jian‐Qiang Lu, Young Seol Kwon, EngineeringBack-end CompatibilityMechanical EngineeringIc Technology PlatformWafer-level 3D	2004	32
Bonding interfaces in wafer-level metal/adhesive bonded 3D integration J. J. McMahon, Eric Chun Yong Chan, S. H. Lee, EngineeringMechanical EngineeringBcb TopographyInterconnect (Integrated Circuits)Wafer Scale Processing	2008	28
High-temperature “in-situ” surface Raman spectroelectrochemistry in aqueous solutions C. A. Melendres, J. J. McMahon, W.E. Ruther Journal of Electroanalytical Chemistry Spectroscopic MethodEngineeringNatural SciencesSpectroscopySurface Science	1986	19
3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces Jian-Qiang Lü, J. J. McMahon, R.J. Gutmann MRS Proceedings Materials ScienceIntegration Using Adhesive3D Ic ArchitectureWafer Scale ProcessingEngineering	2008	19
Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs Sang Hwui Lee, Frank Niklaus, J. J. McMahon, MRS Proceedings 3D Ic ArchitectureWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Applied Physics	2006	17

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