J. J. McMahon

Viscoplasticity based on overstress with a differential growth law for the equilibrium stress

E. Krempl, J. J. McMahon, D. Yao · Mechanics of Materials · 1986 · 145 citations

Equilibrium Stress, Economics, Viscoplastic Fluid +4

Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration

Frank Niklaus, Ravi Kumar, J. J. McMahon et al. · Journal of The Electrochemical Society · 2006 · 80 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Wafer bonding of damascene-patterned metal/adhesive redistribution layers for via-first three-dimensional (3D) interconnect

J. J. McMahon, Jian‐Qiang Lu, R.J. Gutmann · 2005 · 54 citations

Engineering, Integration Technology Platform, Mechanical Engineering +18

Passive microfluidic device for submillisecond mixing

Zonghuan Lu, J. J. McMahon, Hisham Mohamed et al. · Sensors and Actuators B Chemical · 2009 · 53 citations

Engineering, Fluid Mechanics, Passive Microfluidic Device +3

Evaluation procedures for wafer bonding and thinning of interconnect test structures for 3D ICs

Jian‐Qiang Lu, Anurag Jindal, Yongchai Kwon et al. · 2004 · 40 citations

Engineering, Evaluation Procedures, Interconnect (Integrated Circuits) +18