Concepedia

Three-dimensional Integration

Three-Dimensional Integration is a semiconductor packaging framework that enables the vertical stacking of multiple device layers or chips with through-silicon vias and interlayer interconnects, thereby achieving higher functionality density and improved electrical performance compared to planar integration.

2.1K

Publications

91.4K

Citations

7.6K

Authors

933

Institutions

Publications per year

2017–2026

408

Parents

Publications

2.1K

A multicenter numerical integration scheme for polyatomic molecules

Axel D. Becke · The Journal of Chemical Physics · 1988 · 2.7K citations

, , +13

Efficient molecular numerical integration schemes

Oliver Treutler, Reinhart Ahlrichs · The Journal of Chemical Physics · 1995 · 2.5K citations

, , +17

3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration

Kaustav Banerjee, S.J. Souri, Pawan Kapur et al. · Proceedings of the IEEE · 2001 · 1K citations

, , +17

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

Max M. Shulaker, Gage Hills, Rebecca Park et al. · Nature · 2017 · 843 citations

, , +16

Three-dimensional integrated circuits

Anna W. Topol, Douglas Charles La Tulipe, D.J. Frank et al. · IBM Journal of Research and Development · 2006 · 701 citations

, , +17

1–5 of 2.1K

Authors

7.6K

  1. EB
    Eric Beyne

    IMEC, Belgium

    79 publications · 3.3K citations

    33

    h-index

  2. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    54 publications · 3.1K citations

    28

    h-index

  3. SK
    Sung Kyu Lim

    Georgia Institute of Technology, United States

    49 publications · 2.1K citations

    27

    h-index

  4. KC
    Kuan‐Neng Chen

    National Yang Ming Chiao Tung University, Taiwan

    44 publications · 2.7K citations

    26

    h-index

  5. MK
    Mitsumasa Koyanagi

    Tohoku University, Japan

    53 publications · 2.6K citations

    25

    h-index

1–5 of 7.6K

Institutions

933

  1. Georgia Institute of Technology

    Atlanta, United States

    44 h-index

    464 publications

    22.1K citations

  2. IMEC

    Leuven, Belgium

    41 h-index

    1.1K publications

    51.8K citations

  3. Commissariat à l'Énergie Atomique et aux Énergies Alternatives

    Paris, France

    37 h-index

    1K publications

    46.3K citations

  4. Laboratoire d'Électronique des Technologies de l'Information

    Grenoble, France

    36 h-index

    927 publications

    41.2K citations

  5. CEA Grenoble

    Grenoble, France

    33 h-index

    914 publications

    38.8K citations

  6. IBM Research - Thomas J. Watson Research Center

    Yorktown Heights, United States

    29 h-index

    246 publications

    32.5K citations

  7. IBM (United States)

    Armonk, United States

    28 h-index

    357 publications

    23.2K citations

  8. Institut polytechnique de Grenoble

    Grenoble, France

    28 h-index

    611 publications

    27.1K citations

1–8 of 933

Venues

  1. 27

    h-index

  2. Microelectronic Engineering

    48 publications · 1.9K citations

    25

    h-index

  3. IEEE Transactions on Electron Devices

    46 publications · 2.1K citations

    25

    h-index

  4. IEEE Electron Device Letters

    34 publications · 1.2K citations

    19

    h-index

  5. Applied Physics Letters

    20 publications · 1.1K citations

    18

    h-index

1–5