Kuan‐Neng Chen

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Chien-Min Liu, Han-wen Lin, Yi-Sa Huang et al. · Scientific Reports · 2015 · 237 citations · Full text

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

Wen-Wei Shen, Kuan‐Neng Chen · Nanoscale Research Letters · 2017 · 216 citations · Full text

Engineering, Device Integration, Integrated Circuits +19

Wafer-level bonding/stacking technology for 3D integration

Cheng-Ta Ko, Kuan‐Neng Chen · Microelectronics Reliability · 2009 · 190 citations

Materials Science, 3D Ic Architecture, Wafer Scale Processing +8

Wafer-level 3D integration technology

Steven J. Koester, Anthony Young, R. Yu et al. · IBM Journal of Research and Development · 2008 · 173 citations

Engineering, Device Integration, Industrial Engineering +16

Low temperature bonding technology for 3D integration

Cheng-Ta Ko, Kuan‐Neng Chen · Microelectronics Reliability · 2011 · 164 citations

Materials Science, Materials Engineering, 3D Ic Architecture +8