Concepedia

Cheng-Ta Ko

CK

4

Publications

438

Citations

4

H-Index

2009

Active since

Affiliations

National Yang Ming Chiao Tung University(Current)

Cheng-Ta Ko is an author at National Yang Ming Chiao Tung University specializing in 3d printing, 3d integration, and engineering.

Top concepts

Publications per year

2009–2012

4

Publications

4

Wafer-level bonding/stacking technology for 3D integration

Cheng-Ta Ko, Kuan‐Neng Chen · Microelectronics Reliability · 2009 · 190 citations

, , +8

Low temperature bonding technology for 3D integration

Cheng-Ta Ko, Kuan‐Neng Chen · Microelectronics Reliability · 2011 · 164 citations

, , +8

Reliability of key technologies in 3D integration

Cheng-Ta Ko, Kuan‐Neng Chen · Microelectronics Reliability · 2012 · 62 citations

, , +10

Wafer-to-wafer hybrid bonding technology for 3D IC

Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu et al. · 2010 · 22 citations

, , +16

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