Zhi-Cheng Hsiao

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang et al. · 2011 · 40 citations

Engineering, Reliability Assessment, Integrated Circuits +21

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Ching-Kuan Lee, Tao‐Chih Chang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 32 citations

Engineering, Wafer Bumping, Interconnect (Integrated Circuits) +20

Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology

Zhi-Cheng Hsiao, Cheng-Ta Ko, Hsiang‐Hung Chang et al. · 2015 · 27 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +17

Wafer-to-wafer hybrid bonding technology for 3D IC

Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu et al. · 2010 · 22 citations

Engineering, Mechanical Engineering, Wafer Scale Processing +16

A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application

Cheng-Ta Ko, Zhi-Cheng Hsiao, Yao-Jen Chang et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 22 citations

Engineering, Cu Tsvs, Three-dimensional Memory Application +20