Yao-Jen Chang

Electrical and Reliability Investigation of Cu TSVs With Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme

Yao-Jen Chang, Cheng-Ta Ko, Kuan‐Neng Chen · IEEE Electron Device Letters · 2012 · 29 citations

Engineering, Electrical Engineering, Materials Science +17

Submicron Cu/Sn Bonding Technology With Transient Ni Diffusion Buffer Layer for 3DIC Application

Yao-Jen Chang, Y. F. Hsieh, Kuan‐Neng Chen · IEEE Electron Device Letters · 2014 · 24 citations

Engineering, Materials Engineering, Materials Science +17

A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application

Cheng-Ta Ko, Zhi-Cheng Hsiao, Yao-Jen Chang et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 22 citations

Engineering, Computer Engineering, Interface Science +16

Modeling and Characterization of TSV Capacitor and Stable Low-Capacitance Implementation for Wide-I/O Application

Yao-Jen Chang, Cheng-Ta Ko, Tsung-Han Yu et al. · IEEE Transactions on Device and Materials Reliability · 2015 · 18 citations

Engineering, Electrical Engineering, Materials Science +17

Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding

Ya-Sheng Tang, Hsiu-Chi Chen, Yi-Tung Kho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 15 citations

Engineering, Materials Engineering, Materials Science +16