Cheng-Ta Ko

Publications

1.1K

Citations

H-Index

2006

Active since

Affiliations

Industrial Technology Research Institute(Current)

National Yang Ming Chiao Tung University

ASM Pacific Technology (China)

Indium Corporation (United States)

Dow Chemical (United States)

Cheng-Ta Ko is an author at Industrial Technology Research Institute specializing in microelectronics, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringMicrofabricationMaterial Science3D PrintingComputer EngineeringAdvanced PackagingThree-dimensional Heterogeneous Integration

Publications per year

2006–2022

Publications

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 147 citations

Electrical Engineering, Chip-scale Package, Engineering +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 83 citations

3D Ic Architecture, Electrical Engineering, New Assembly Process +15

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 47 citations

Engineering, Energy Efficiency, Computer Architecture +16

Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

John H. Lau, Ming Li, Lei Yang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 46 citations

Engineering, Mechanical Engineering, Fowlp Fabrication +19

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · 2017 · 44 citations

Electrical Engineering, Chip Size, Engineering +15

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