Concepedia
Statistics
Publications
330
Citations
11.2K
Authors
41
Location
Hong Kong, China
Also known as ASMPT
ASM Pacific Technology (China) is a company institution in Hong Kong, China known for engineering, chip packaging, and electrical engineering.
Top concepts
EngineeringChip PackagingPackaging EngineeringMaterials EngineeringSemiconductor DevicesWafer-level PackagingFan-out Wafer-level PackagingMaterials ScienceWafer BondingPackaging Design
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 155 citations
Engineering, Materials Engineering, Materials Science +17
Non-steroidal anti-inflammatory drug (NSAID) therapy in patients with hypertension, cardiovascular, renal or gastrointestinal comorbidities: joint APAGE/APLAR/APSDE/APSH/APSN/PoA recommendations
Cheuk‐Chun Szeto, Kentaro Sugano, Ji‐Guang Wang et al. · Gut · 2020 · 151 citations
Pharmacy, Pharmacology, Pharmacotherapy +16
Recent Advances and New Trends in Flip Chip Technology
John H. Lau · Journal of Electronic Packaging · 2016 · 150 citations
Engineering, Electrical Engineering, Packaging Design +13
Impact of Perceived Leadership Styles on Work Outcomes: Case of Building Professionals
Antony T. S. Chan, Edwin H.W. Chan · Journal of Construction Engineering and Management · 2005 · 132 citations
Management, Construction Management, Leadership +13
A Multiple-Goal Reinforcement Learning Method for Complex Vehicle Overtaking Maneuvers
Daniel C. K. Ngai, N.H.C. Yung · IEEE Transactions on Intelligent Transportation Systems · 2011 · 128 citations
Computing, Autonomous Systems, Robotics Engineering +16
1–5 of 330
ASM Pacific Technology (China), China
830 publications · 1.6K citations
19
h-index
39 publications · 956 citations
17
77 publications · 1K citations
16
28 publications · 798 citations
14
20 publications · 700 citations
13
1–5 of 41