Concepedia
Statistics
Publications
315
Citations
10.5K
Authors
49
Location
Hong Kong, China
Also known as ASMPT
ASM Pacific Technology (China) is a company institution in Hong Kong, China known for engineering, electrical engineering, and electronic packaging.
Top concepts
EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringComputer EngineeringHeat TransferMicrofabricationMechanical Engineering3D PrintingMaterial Science
Recent Advances and New Trends in Flip Chip Technology
John H. Lau · Journal of Electronic Packaging · 2016 · 147 citations
Electrical Engineering, Flip Chip Technology, Engineering +13
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 147 citations
Electrical Engineering, Chip-scale Package, Engineering +15
Non-steroidal anti-inflammatory drug (NSAID) therapy in patients with hypertension, cardiovascular, renal or gastrointestinal comorbidities: joint APAGE/APLAR/APSDE/APSH/APSN/PoA recommendations
Cheuk‐Chun Szeto, Kentaro Sugano, Ji‐Guang Wang et al. · Gut · 2020 · 144 citations
A Multiple-Goal Reinforcement Learning Method for Complex Vehicle Overtaking Maneuvers
Daniel C. K. Ngai, N.H.C. Yung · IEEE Transactions on Intelligent Transportation Systems · 2011 · 123 citations
Artificial Intelligence, Trajectory Planning, Engineering +15
Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
John H. Lau · Journal of Electronic Packaging · 2019 · 115 citations
Electrical Engineering, Chip-scale Package, Engineering +12
1–5 of 315
ASM Pacific Technology (China), China
831 publications · 1.6K citations
19
h-index
39 publications · 926 citations
16
76 publications · 1K citations
28 publications · 778 citations
14
27 publications · 700 citations
13
1–5 of 49