ASM Pacific Technology (China)

Recent Advances and New Trends in Flip Chip Technology

John H. Lau · Journal of Electronic Packaging · 2016 · 147 citations

Electrical Engineering, Flip Chip Technology, Engineering +13

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 147 citations

Electrical Engineering, Chip-scale Package, Engineering +15

Non-steroidal anti-inflammatory drug (NSAID) therapy in patients with hypertension, cardiovascular, renal or gastrointestinal comorbidities: joint APAGE/APLAR/APSDE/APSH/APSN/PoA recommendations

Cheuk‐Chun Szeto, Kentaro Sugano, Ji‐Guang Wang et al. · Gut · 2020 · 144 citations

A Multiple-Goal Reinforcement Learning Method for Complex Vehicle Overtaking Maneuvers

Daniel C. K. Ngai, N.H.C. Yung · IEEE Transactions on Intelligent Transportation Systems · 2011 · 123 citations

Artificial Intelligence, Trajectory Planning, Engineering +15

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

John H. Lau · Journal of Electronic Packaging · 2019 · 115 citations

Electrical Engineering, Chip-scale Package, Engineering +12