Concepedia

Eric Kuah

EK

15

Publications

664

Citations

13

H-Index

2017

Active since

Affiliations

ASM Pacific Technology (China)(Current)

Indium Corporation (United States)

Hong Kong University of Science and Technology

Micron Corporation (United States)

Dow Chemical (United States)

Eric Kuah is an author at ASM Pacific Technology (China) specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringElectronic PackagingMicroelectronicsElectrical EngineeringHeat TransferMicrofabricationComputer Engineering3D PrintingMaterial ScienceMechanical Engineering

Publications per year

2017–2018

15

Publications

15

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 147 citations

Electrical Engineering, Chip-scale Package, Engineering +15

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 91 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 83 citations

3D Ic Architecture, Electrical Engineering, New Assembly Process +15

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 47 citations

Engineering, Energy Efficiency, Computer Architecture +16

Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

John H. Lau, Ming Li, Lei Yang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 46 citations

Engineering, Mechanical Engineering, Fowlp Fabrication +19

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