Zhang Li

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 147 citations

Electrical Engineering, Chip-scale Package, Engineering +15

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 91 citations

Advanced Packaging, Electrical Engineering, Chip-scale Package +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 83 citations

3D Ic Architecture, Electrical Engineering, New Assembly Process +15

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 47 citations

Engineering, Energy Efficiency, Computer Architecture +16

Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

John H. Lau, Ming Li, Lei Yang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 46 citations

Engineering, Mechanical Engineering, Fowlp Fabrication +19