Concepedia

Rozalia Beica

RB

Statistics

Publications

22

Citations

965

H-Index

16

Active since

2008

Affiliations

ASM Pacific Technology (China)(Current)

Indium Corporation (United States)

Hong Kong University of Science and Technology

Huawei Technologies (China)

Dow Chemical (United States)

Rozalia Beica is an author at ASM Pacific Technology (China) specializing in chip packaging, engineering, and semiconductor devices.

Publications per year

2008–2018

22

Publications

22

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 155 citations

Engineering, Materials Engineering, Materials Science +17

Through silicon via copper electrodeposition for 3D integration

Rozalia Beica, Charles Sharbono, Tom Ritzdorf · 2008 · 126 citations

Engineering, Materials Engineering, Materials Science +17

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 93 citations

Engineering, Electrical Engineering, Materials Science +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 85 citations

Engineering, Computer Engineering, Manufacturing Processes +13

Advanced Metallization for 3D Integration

Rozalia Beica, Paul Siblerud, Charles Sharbono et al. · 2008 · 53 citations

Engineering, Materials Engineering, Materials Science +17

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