Tao‐Chih Chang

Grey relation analysis of carbon dioxide emissions from industrial production and energy uses in Taiwan

Tao‐Chih Chang, Sue J. Lin · Journal of Environmental Management · 1999 · 147 citations

Engineering, Emissions, Carbon Dioxide Emissions +11

Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration

Tzu-Chieh Chou, Shin‐Yi Huang, Pin-Jun Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 55 citations

Engineering, Ag Passivation Layer, Interconnect (Integrated Circuits) +18

Development of Cu-Ag pastes for high temperature sustainable bonding

Ching-Huan Hsiao, Wan-Ting Kung, Jenn‐Ming Song et al. · Materials Science and Engineering A · 2016 · 52 citations

Materials Engineering, Materials Science, Engineering +3

Solderability of Sn–9Zn–0.5Ag–1In lead-free solder on Cu substrate

Tao‐Chih Chang, Jianwen Wang, Moo-Chin Wang et al. · Journal of Alloys and Compounds · 2006 · 51 citations

Materials Engineering, Materials Science, Engineering +4

Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits

Fan-Yi Ouyang, Wei-Cheng Jhu, Tao‐Chih Chang · Journal of Alloys and Compounds · 2013 · 51 citations

Materials Science, Materials Engineering, Sn2.5ag Alloys +10