Jing-Ye Juang

Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking

Yu-Min Lin, Chau‐Jie Zhan, Jing-Ye Juang et al. · 2011 · 53 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +17

Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection

Chau‐Jie Zhan, Chun-Chih Chuang, Jing-Ye Juang et al. · 2010 · 50 citations

Engineering, Fine Pitch, Integrated Circuits +21

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Chau‐Jie Zhan, Jing-Ye Juang, Yu-Min Lin et al. · 2011 · 36 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15

Drop Impact Reliability Analysis of 3-D Chip-on-Chip Packaging: Numerical Modeling and Experimental Validation

Hsien‐Chie Cheng, Hsin-Kai Cheng, Su‐Tsai Lu et al. · IEEE Transactions on Device and Materials Reliability · 2013 · 31 citations

Engineering, Experimental Validation, Mechanical Engineering +22

Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking

Su‐Tsai Lu, Jing-Ye Juang, Hsien‐Chie Cheng et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 30 citations

Engineering, Three-dimensional Chip Stacking, Integrated Circuits +19