Concepedia
Statistics
Publications
63
Citations
1.9K
H-Index
26
Active since
1994
Affiliations
Feng Chia University(Current)
National Tsing Hua University
Industrial Technology Research Institute
National Center for High-Performance Computing
National Institutes of Applied Research
Hsien‐Chie Cheng is an author at Feng Chia University specializing in engineering, materials science, and mechanical engineering.
Top concepts
EngineeringMaterial ScienceMechanical EngineeringElectronic PackagingMicroelectronicsMechanics Of MaterialsElectrical EngineeringApplied PhysicsThermal EngineeringSolid Mechanics
Publications per year
1994–2024
An improved approach for determining the optimal orientation of orthotropic material
Hsien‐Chie Cheng, Noboru Kikuchi, Z. D. · Structural and Multidisciplinary Optimization · 1994 · 89 citations · Full text
Geometric Modeling, Materials Science, Engineering +9
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging
Wen‐Hwa Chen, Ching-Feng Yu, Hsien‐Chie Cheng et al. · Microelectronics Reliability · 2012 · 82 citations
Materials Science, Materials Engineering, 3D Ic Architecture +12
First-principles density functional calculation of mechanical, thermodynamic and electronic properties of CuIn and Cu2In crystals
Hsien‐Chie Cheng, Ching-Feng Yu, Wen‐Hwa Chen · Journal of Alloys and Compounds · 2012 · 80 citations
Materials Science, Engineering, Cu2in Crystals +10
Atomistic-continuum modeling for mechanical properties of single-walled carbon nanotubes
Hsien‐Chie Cheng, Yang-Lun Liu, Yu‐Chen Hsu et al. · International Journal of Solids and Structures · 2008 · 77 citations
Materials Science, One-dimensional Material, Engineering +7
Reliability Analysis and Design for the Fine-Pitch Flip Chip BGA Packaging
Cheng Peng, C.-M. Liu, Jujian Lin et al. · IEEE Transactions on Components and Packaging Technologies · 2004 · 73 citations
Electrical Engineering, Chip-scale Package, Engineering +15
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