Chun-Chih Chuang

Publications

Citations

H-Index

2008

Active since

Affiliations

Industrial Technology Research Institute(Current)

Chun-Chih Chuang is an author at Industrial Technology Research Institute specializing in microfabrication, electronic packaging, and microelectronics.

Top concepts

EngineeringMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingAdvanced PackagingIntegrated CircuitsElectrical Engineering3D Printing3D Integration

Publications per year

2008–2015

Publications

Assembly and reliability characterization of 3D chip stacking with 30&#x03BC;m pitch lead-free solder micro bump interconnection

Chau‐Jie Zhan, Chun-Chih Chuang, Jing-Ye Juang et al. · 2010 · 50 citations

Engineering, Fine Pitch, Integrated Circuits +21

Influence of underfill materials on the reliability of coreless flip chip package

Chun-Chih Chuang, Tsung‐Fu Yang, Jin-Ye Juang et al. · Microelectronics Reliability · 2008 · 17 citations

Materials Science, Chip-scale Package, Engineering +8

Development of a Novel Compliant-Bump Structure for ACA-Bonded Chip-on-Flex (COF) Interconnects With Ultra-Fine Pitch

Su‐Tsai Lu, Yu-Min Lin, Chun-Chih Chuang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2010 · 11 citations

Engineering, Mechanical Engineering, Integrated Circuits +21

Simultaneous Transistor Pairing and Placement for CMOS Standard Cells

Ang Lu, Hsueh‐Ju Lu, En-Jang Jang et al. · Design, Automation & Test in Europe Conference & Exhibition (DATE), 2015 · 2015 · 10 citations

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