Influence of underfill materials on the reliability of coreless flip chip package

Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling

Μ. Y. Tsai, C. H. Hsu, C.T.O. Wang · IEEE Transactions on Components and Packaging Technologies · 2004 · 110 citations

Engineering, Materials Engineering, Materials Science +17

Dielectric Properties of Industrial Polymer Composite Materials

Muhammad Akram, Athar Javed, Tasneem Zahra Rizvi · DergiPark (Istanbul University) · 2005 · 70 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

High-temperature reliability of Flip Chip assemblies

T. Braun, Karl‐Friedrich Becker, Matthias Koch et al. · Microelectronics Reliability · 2005 · 53 citations

Engineering, Materials Engineering, Materials Science +14

The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages

Jinlin Wang · Microelectronics Reliability · 2007 · 50 citations

Engineering, Materials Engineering, Materials Science +12

Reliability of flip chip and chip size packages

H. Reichl, Andreas Schubert, Michael J. Topper · Microelectronics Reliability · 2000 · 44 citations

Engineering, Computer Engineering, Fault-tolerant Computing +13