Concepedia

Underfill Materials

Underfill Materials is a polymeric composite material used in semiconductor packaging that, through capillary action, fills the gap between a chip and substrate to mitigate thermomechanical stress and enhance interconnect reliability by providing mechanical support and environmental protection.

434

Publications

14.2K

Citations

1.2K

Authors

232

Institutions

Publications per year

2017–2026

27

Parents

Publications

434

Emerging challenges and materials for thermal management of electronics

Arden L. Moore, Li Shi · Materials Today · 2014 · 2K citations · Full text

, , +17

Ice‐Templated Assembly Strategy to Construct 3D Boron Nitride Nanosheet Networks in Polymer Composites for Thermal Conductivity Improvement

Xiaoliang Zeng, Yimin Yao, Zhengyu Gong et al. · Small · 2015 · 612 citations

, , +14

Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability

Zhe Zhang, C.P. Wong · IEEE Transactions on Advanced Packaging · 2004 · 243 citations · Full text

, , +17

Study on mono-dispersed nano-size silica by surface modification for underfill applications

Yangyang Sun, Zhuqing Zhang, C.P. Wong · Journal of Colloid and Interface Science · 2005 · 232 citations

, , +16

Comparative study of thermally conductive fillers in underfill for the electronic components

Woong Sun Lee, Jin Yu · Diamond and Related Materials · 2005 · 178 citations

, , +16

1–5 of 434

Authors

1.2K

  1. CW
    C.P. Wong

    Georgia Institute of Technology, United States

    73 publications · 2.6K citations

    27

    h-index

  2. JH
    John H. Lau

    Industrial Technology Research Institute, Taiwan

    19 publications · 487 citations

    13

    h-index

  3. DB
    D.F. Baldwin

    Georgia Institute of Technology, United States

    12 publications · 237 citations

    11

    h-index

  4. SS
    S.H. Shi

    Georgia Institute of Technology, United States

    11 publications · 552 citations

    11

    h-index

  5. PL
    Pradeep Lall

    Auburn University, United States

    15 publications · 289 citations

    11

    h-index

1–5 of 1.2K

Institutions

232

  1. Georgia Institute of Technology

    Atlanta, United States

    30 h-index

    253 publications

    8.8K citations

  2. Auburn University

    Auburn, United States

    14 h-index

    79 publications

    1.9K citations

  3. Intel (United States)

    Santa Clara, United States

    12 h-index

    46 publications

    1.2K citations

  4. Universiti Sains Malaysia

    George Town, Malaysia

    12 h-index

    43 publications

    1.2K citations

  5. Nanyang Technological University

    Singapore, Singapore

    12 h-index

    31 publications

    846 citations

  6. Hewlett-Packard (United States)

    Palo Alto, United States

    10 h-index

    17 publications

    689 citations

  7. Motorola (United States)

    Schaumburg, United States

    10 h-index

    31 publications

    561 citations

  8. Institute of Microelectronics

    Singapore, Singapore

    10 h-index

    79 publications

    1.8K citations

1–8 of 232

Venues

  1. 19

    h-index

  2. Microelectronics Reliability

    23 publications · 713 citations

    17

    h-index

  3. 14

    h-index

  4. IEEE Transactions on Advanced Packaging

    16 publications · 606 citations

    12

    h-index

  5. Journal of Electronic Packaging

    17 publications · 332 citations

    12

    h-index

1–5