D.F. Baldwin

An integrated computer aid for generating and evaluating assembly sequences for mechanical products

D.F. Baldwin, T.E. Abell, Mark Lui et al. · IEEE Transactions on Robotics and Automation · 1991 · 344 citations

Mechanical Products, Engineering, Industrial Engineering +23

The viscoelastic behavior of microcellular plastics with varying cell size

M. Shimbo, D.F. Baldwin, Nam P. Suh · Polymer Engineering and Science · 1995 · 102 citations

Tissue Engineering, Cell Size, Engineering +13

High density, high aspect ratio through-wafer electrical interconnect vias for mems packaging

Seong Joon Ok, Chun‐Ho Kim, D.F. Baldwin · IEEE Transactions on Advanced Packaging · 2003 · 63 citations

Mems Devices, Engineering, Mechanical Engineering +21

Reliability assessment of microvias in HDI printed circuit boards

Fuhan Liu, Jicun Lu, V. Sundaram et al. · IEEE Transactions on Components and Packaging Technologies · 2002 · 45 citations

Engineering, Reliability Assessment, Thermal Shock +20

Correlation of flip chip underfill process parameters and material properties with in-process stress generation

Prema Palaniappan, D.F. Baldwin, P.J. Selman et al. · IEEE Transactions on Electronics Packaging Manufacturing · 1999 · 44 citations

Engineering, Mechanical Engineering, Flip Chip +17