Concepedia

Prema Palaniappan

PP

Statistics

Publications

3

Citations

97

H-Index

3

Active since

1999

Affiliations

Georgia Institute of Technology(Current)

Prema Palaniappan is an author at Georgia Institute of Technology specializing in electronic packaging, mechanics of materials, and mechanical engineering.

Top concepts

Publications per year

1999–2003

3

Publications

3

Correlation of flip chip underfill process parameters and material properties with in-process stress generation

Prema Palaniappan, D.F. Baldwin, P.J. Selman et al. · IEEE Transactions on Electronics Packaging Manufacturing · 1999 · 44 citations

, , +17

In process stress analysis of flip-chip assemblies during underfill cure

Prema Palaniappan, Daniel F. Baldwin · Microelectronics Reliability · 2000 · 41 citations

, , +9

Numerical and experimental study of the evolution of stresses in flip chip assemblies during assembly and thermal cycling

Carlton Hanna, S. Michaelides, Prema Palaniappan et al. · 2003 · 12 citations

, , +21

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