Woong Sun Lee

Statistics

Publications

Citations

186

H-Index

Active since

2005

Affiliations

Korea Advanced Institute of Science and Technology(Current)

Woong Sun Lee is an author at Korea Advanced Institute of Science and Technology specializing in electronic packaging, materials engineering, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringElectrical EngineeringHeat TransferMicrostructureThermodynamicsMicroelectronicsMicrofabrication

Publications per year

2005–2008

Publications

Comparative study of thermally conductive fillers in underfill for the electronic components

Woong Sun Lee, Jin Yu · Diamond and Related Materials · 2005 · 175 citations

Materials Engineering, Materials Science, Electrical Engineering +14

Reliability issues on the high speed DRAM flip-chip package using gold stud bump, lead free solder, and underfill

Woong Sun Lee, Myoung Geun Park, I Whan Cho et al. · 2008 · 11 citations

Engineering, Gold Stud, Mechanical Engineering +16

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