Concepedia
Statistics
Publications
1
Citations
11
H-Index
Active since
2008
I Whan Cho is an author specializing in materials engineering, electronic packaging, and microfabrication.
Top concepts
EngineeringMicrostructureMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMaterials EngineeringElectrical EngineeringMechanical Engineering
Publications per year
2008–2008
Reliability issues on the high speed DRAM flip-chip package using gold stud bump, lead free solder, and underfill
Woong Sun Lee, Myoung Geun Park, I Whan Cho et al. · 2008 · 11 citations
Engineering, Gold Stud, Mechanical Engineering +16
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