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Pei-Chen Chang

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Publications

3

Citations

90

H-Index

3

Active since

2008

Affiliations

Industrial Technology Research Institute(Current)

Pei-Chen Chang is an author at Industrial Technology Research Institute specializing in chip packaging, underfill materials, and electronic materials.

Publications per year

2008–2012

3

Publications

3

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang et al. · 2011 · 40 citations

, , +15

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Ching-Kuan Lee, Tao‐Chih Chang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 33 citations

, , +17

Influence of underfill materials on the reliability of coreless flip chip package

Chun-Chih Chuang, Tsung‐Fu Yang, Jin-Ye Juang et al. · Microelectronics Reliability · 2008 · 17 citations

, , +13

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