Ching-Kuan Lee

Statistics

Publications

Citations

309

H-Index

Active since

2007

Affiliations

Industrial Technology Research Institute(Current)

ITRI International

Corning (United States)

Ching-Kuan Lee is an author at Industrial Technology Research Institute specializing in engineering, integrated circuit fabrication, and three-dimensional integration.

Publications per year

2007–2014

Publications

Through-Silicon Hole Interposers for 3-D IC Integration

John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 46 citations · Full text

Engineering, Computer Engineering, Packaging Design +16

Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration

Chun-Hsien Chien, Ching-Kuan Lee, Hsun Yu et al. · IMAPSource Proceedings · 2013 · 43 citations

Engineering, Electrical Engineering, Materials Science +17

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang et al. · 2011 · 40 citations

Engineering, Materials Engineering, Materials Science +15

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Ching-Kuan Lee, Tao‐Chih Chang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 33 citations

Engineering, Materials Engineering, Materials Science +17

Process integration of 3D Si interposer with double-sided active chip attachments

Pei-Jer Tzeng, John H. Lau, Chau‐Jie Zhan et al. · 2013 · 25 citations

Engineering, Electrical Engineering, Microelectronics +16

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