Yu-Jiau Huang

Publications

Citations

H-Index

2011

Active since

Affiliations

Industrial Technology Research Institute(Current)

Yu-Jiau Huang is an author at Industrial Technology Research Institute specializing in advanced packaging, microfabrication, and electronic packaging.

Top concepts

3D PrintingEngineeringMicrostructureMaterial ScienceMicroelectronicsMicrofabricationAdvanced PackagingElectronic PackagingElectrical Engineering3D Integration

Publications per year

2011–2012

Publications

Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration

Ching-Kuan Lee, Tao‐Chih Chang, Yu-Jiau Huang et al. · 2011 · 40 citations

Engineering, Reliability Assessment, Integrated Circuits +21

Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration

Ching-Kuan Lee, Tao‐Chih Chang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 32 citations

Engineering, Wafer Bumping, Interconnect (Integrated Circuits) +20

Wafer bumping, assembly, and reliability assessment of &#x03BC;bumps with 5&#x03BC;m pads on 10&#x03BC;m pitch for 3D IC integration

Ching-Kuan Lee, Chau‐Jie Zhan, John H. Lau et al. · 2012 · 10 citations

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