Chau‐Jie Zhan

Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking

Yu-Min Lin, Chau‐Jie Zhan, Jing-Ye Juang et al. · 2011 · 53 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +17

Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection

Chau‐Jie Zhan, Chun-Chih Chuang, Jing-Ye Juang et al. · 2010 · 50 citations

Engineering, Fine Pitch, Integrated Circuits +21

Through-Silicon Hole Interposers for 3-D IC Integration

John H. Lau, Ching-Kuan Lee, Chau‐Jie Zhan et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2014 · 45 citations · Full text

Top Chip, Through-silicon Hole Interposers, Electrical Engineering +15

Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration

Chun-Hsien Chien, Ching-Kuan Lee, Hsun Yu et al. · IMAPSource Proceedings · 2013 · 42 citations

Engineering, Device Integration, Process Comparison +19

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Chau‐Jie Zhan, Jing-Ye Juang, Yu-Min Lin et al. · 2011 · 36 citations

Materials Science, 3D Ic Architecture, Electrical Engineering +15