Tzu-Chieh Chou

Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration

Tzu-Chieh Chou, Shin‐Yi Huang, Pin-Jun Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 62 citations

Natural Sciences, Materials Engineering, Materials Science +16

Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation

Demin Liu, Po‐Chih Chen, Tzu-Chieh Chou et al. · IEEE Journal of the Electron Devices Society · 2021 · 57 citations · Full text

Engineering, Electrical Engineering, Materials Science +14

Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration

Demin Liu, Tsung-Yi Kuo, Yuwei Liu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 50 citations

Engineering, Electrical Engineering, Materials Science +17

OPTIMIZATION OF RESISTANCE SPOT WELDING PROCESS USING TAGUCHI METHOD AND A NEURAL NETWORK

Hsuan-Liang Lin, Tzu-Chieh Chou, C. P. Chou · Experimental Techniques · 2007 · 38 citations

Engineering, Industrial Engineering, Manufacturing Engineering +12

A Rapid Capillary-Pressure Driven Micro-Channel to Demonstrate Newtonian Fluid Behavior of Zebrafish Blood at High Shear Rates

Juhyun Lee, Tzu-Chieh Chou, Dongyang Kang et al. · Scientific Reports · 2017 · 33 citations · Full text

Engineering, Bioengineering, Physics +17