Shin‐Yi Huang

Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration

Tzu-Chieh Chou, Shin‐Yi Huang, Pin-Jun Chen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 55 citations

Engineering, Ag Passivation Layer, Interconnect (Integrated Circuits) +18

Microwave-Promoted, Metal- and Catalyst-Free Decarboxylative α,β-Difunctionlization of Secondary α-Amino Acids via Pseudo-Four-Component Reactions

Kiran B. Manjappa, Wei‐Fang Jhang, Shin‐Yi Huang et al. · Organic Letters · 2014 · 52 citations

Catalyst-free Decarboxylative α, Cross-coupling Reaction, Engineering +12

Sensitivity of typhoon track to asymmetric latent heating/rainfall induced by Taiwan topography: A numerical study of Typhoon Fanapi (2010)

Chung‐Chieh Wang, Yuhan Chen, Hung‐Chi Kuo et al. · Journal of Geophysical Research Atmospheres · 2013 · 43 citations · Full text

Storm Surge, Engineering, Climate Modeling +17

Low temperature Ag-Ag direct bonding under air atmosphere

Leh-Ping Chang, Shin‐Yi Huang, Tao‐Chih Chang et al. · Journal of Alloys and Compounds · 2021 · 34 citations

Materials Science, Interface Property

Copper(I)-Catalyzed Nitrile-Addition/<i>N</i>-Arylation Ring-Closure Cascade: Synthesis of 5,11-Dihydro-6<i>H</i>-indolo[3,2-<i>c</i>]quinolin-6-ones as Potent Topoisomerase-I Inhibitors

Wen-Yun Hsueh, Ying-Shuan E. Lee, Min-Sian Huang et al. · Journal of Medicinal Chemistry · 2021 · 27 citations · Full text