Concepedia

Tsung-Yi Kuo

TK

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Publications

2

Citations

74

H-Index

2

Active since

2018

Affiliations

National Taiwan University(Current)

Tsung-Yi Kuo is an author at National Taiwan University specializing in chip packaging, engineering, and electrical engineering.

ORCID

Publications per year

2018–2021

2

Publications

2

Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration

Demin Liu, Tsung-Yi Kuo, Yuwei Liu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 50 citations

, , +17

Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application

Kai-Bin Wu, Tsung-Yi Kuo, Cheng-Chou Hung et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 24 citations

, , +16

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