Hsiang‐Hung Chang

Low Temperature Wafer-To-Wafer Hybrid Bonding by Nanotwinned Copper

Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang et al. · 2021 · 32 citations

Engineering, Integrated Circuits, Metallic Nanomaterials +20

Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology

Zhi-Cheng Hsiao, Cheng-Ta Ko, Hsiang‐Hung Chang et al. · 2015 · 27 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +17

Suppression strategy for process-induced warpage of novel fan-out wafer level packaging

Ching-Feng Yu, Yu-Wei Huang, Tsung-Yu Ouyang et al. · Microelectronics Reliability · 2022 · 26 citations

Suppression Strategy, Engineering, Chip-scale Package +9

Nanotwinned Copper Hybrid Bonding and Wafer-On-Wafer Integration

Wei-Lan Chiu, Kai-Wei Chou, Hsiang‐Hung Chang · 2020 · 21 citations

Performance and process characteristic of glass interposer with through-glass-via(TGV)

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee et al. · 2013 · 20 citations

Engineering, Primary Approach, Organic Substrates +18