Ou-Hsiang Lee

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee et al. · Materials · 2022 · 74 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Low Temperature Wafer-To-Wafer Hybrid Bonding by Nanotwinned Copper

Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang et al. · 2021 · 34 citations

Engineering, Materials Engineering, Materials Science +16

Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper

Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +13

Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafer-to-Wafer Hybrid Bonding

Wei-Lan Chiu, Ou-Hsiang Lee, Tzu-Ying Kuo et al. · 2023 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +17

A hybrid bonding interconnection with a novel low-temperature bonding polymer system

Yu-Min Lin, Po-Chih Chang, Ou-Hsiang Lee et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 16 citations

Engineering, Materials Engineering, Materials Science +17