Ou-Hsiang Lee

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee et al. · Materials · 2022 · 65 citations · Full text

Low Temperature Wafer-To-Wafer Hybrid Bonding by Nanotwinned Copper

Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang et al. · 2021 · 32 citations

Engineering, Integrated Circuits, Metallic Nanomaterials +20

Low-Temperature Wafer-to-Wafer Hybrid Bonding by Nanocrystalline Copper

Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 27 citations

Materials Science, Advanced Packaging, Wafer Scale Processing +14

Low Temperature and Fine Pitch Nanocrystalline Cu/SiCN Wafer-to-Wafer Hybrid Bonding

Wei-Lan Chiu, Ou-Hsiang Lee, Tzu-Ying Kuo et al. · 2023 · 19 citations

Nanosheet, Engineering, Low Temperature +18

Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration

Chih-Cheng Hsiao, Huan‐Chun Fu, Chia-Wen Chiang et al. · 2021 · 15 citations

Engineering, Mechanical Engineering, Feasibility Study +21