Wei-Lan Chiu

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee et al. · Materials · 2022 · 74 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Grain growth in electroplated (111)-oriented nanotwinned Cu

Yi-Sa Huang, Chien-Min Liu, Wei-Lan Chiu et al. · Scripta Materialia · 2014 · 65 citations

Engineering, Materials Engineering, Materials Science +13

Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization

Wei-Lan Chiu, Chien-Min Liu, Yi-Sa Haung et al. · Applied Physics Letters · 2014 · 58 citations

Natural Sciences, Materials Engineering, Materials Science +15

Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

Min-Hsun Yu, Jia-Juen Ong, Dinh-Phuc Tran et al. · Applied Surface Science · 2023 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +14

Low Temperature Wafer-To-Wafer Hybrid Bonding by Nanotwinned Copper

Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang et al. · 2021 · 34 citations

Engineering, Materials Engineering, Materials Science +16