R. Yu

Wafer-level 3D integration technology

Steven J. Koester, Anthony Young, R. Yu et al. · IBM Journal of Research and Development · 2008 · 173 citations

Engineering, Device Integration, Industrial Engineering +16

Electrical integrity of state-of-the-art 0.13 μm SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication

K.W. Guarini, Anna W. Topol, M. Ieong et al. · 2003 · 134 citations

Engineering, Device Integration, Computer Architecture +21

A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid Cu-adhesive bonding

F. Liu, R. Yu, Anthony Young et al. · 2008 · 118 citations

Engineering, Cu Beol, Interconnect (Integrated Circuits) +18

Wafer-Scale Microdevice Transfer/Interconnect: Its Application in an AFM-Based Data-Storage System

M. Despont, Ute Drechsler, R. Yu et al. · Journal of Microelectromechanical Systems · 2004 · 88 citations

Engineering, Device Integration, Computer Architecture +16

FinFET performance advantage at 22nm: An AC perspective

Michael Guillorn, Josephine Chang, A. Bryant et al. · 2008 · 83 citations

Device Modeling, Electrical Engineering, Engineering +11