Anna W. Topol

Three-dimensional integrated circuits

Anna W. Topol, Douglas Charles La Tulipe, D.J. Frank et al. · IBM Journal of Research and Development · 2006 · 701 citations

Engineering, Computer Engineering, Electrical Engineering +17

Stable SRAM cell design for the 32 nm node and beyond

L. Chang, David Fried, J. M. Hergenrother et al. · 2005 · 567 citations

Engineering, Computer Engineering, Electrical Engineering +17

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Electrical integrity of state-of-the-art 0.13 μm SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication

K.W. Guarini, Anna W. Topol, M. Ieong et al. · 2003 · 134 citations

Engineering, Computer Engineering, Electrical Engineering +17

Enabling SOI-based assembly technology for three-dimensional (3d) integrated circuits (ICs)

Anna W. Topol, Douglas Charles La Tulipe, L. Shi et al. · 2006 · 86 citations

Engineering, Manufacturing Engineering, Materials Science +17