Concepedia

B. Dang

BD

Statistics

Publications

20

Citations

1.8K

H-Index

17

Active since

2001

Affiliations

IBM Research - Thomas J. Watson Research Center(Current)

IBM (United States)

IBM Research - Tokyo

Essex Westford School District

Georgia Institute of Technology

B. Dang is an author at IBM Research - Thomas J. Watson Research Center specializing in engineering, integrated circuit design, and chip packaging.

Publications per year

2001–2018

20

Publications

20

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · 2008 · 225 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Katsuyuki Sakuma, Paul Andry, Cornelia Tsang et al. · IBM Journal of Research and Development · 2008 · 163 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +16

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

Paul Andry, Cornelia Tsang, Bucknell C. Webb et al. · IBM Journal of Research and Development · 2008 · 116 citations

Engineering, Computer Engineering, Electrical Engineering +17

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