Bucknell C. Webb

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · 2008 · 225 citations

Engineering, Computer Engineering, Electrical Engineering +17

A 2.5D Integrated Voltage Regulator Using Coupled-Magnetic-Core Inductors on Silicon Interposer

Noah Sturcken, E. J. O’Sullivan, Naigang Wang et al. · IEEE Journal of Solid-State Circuits · 2012 · 170 citations

Engineering, Electrical Engineering, Power Electronics +16

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Katsuyuki Sakuma, Paul Andry, Cornelia Tsang et al. · IBM Journal of Research and Development · 2008 · 163 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +16