L.P. Buchwalter

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

John Knickerbocker, C.S. Patel, Paul Andry et al. · IEEE Journal of Solid-State Circuits · 2006 · 182 citations

Engineering, Vlsi Design, Device Integration +19

Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications

S. L. Wright, R. Polastre, H. Gan et al. · 2006 · 91 citations

Materials Engineering, Electrical Engineering, Chip-scale Package +14

Adhesion of polyimides to metal and ceramic surfaces: an overview

L.P. Buchwalter · Journal of Adhesion Science and Technology · 1990 · 78 citations

Engineering, Mechanical Engineering, Biomedical Engineering +16

Materials Issues in Copper Interconnections

J. M. E. Harper, E. G. Colgan, C-K. Hu et al. · MRS Bulletin · 1994 · 78 citations

Materials Engineering, Materials Science, Electromigration Technique +5