R. Polastre

Statistics

Publications

Citations

2.8K

H-Index

Active since

1991

Affiliations

IBM Research - Thomas J. Watson Research Center(Current)

IBM (United States)

IBM Research - Tokyo

Essex Westford School District

University of Illinois Urbana-Champaign

R. Polastre is an author at IBM Research - Thomas J. Watson Research Center specializing in engineering, integrated circuit design, and chip packaging.

Publications per year

1991–2016

Publications

Three-dimensional silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · IBM Journal of Research and Development · 2008 · 493 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

E. G. Colgan, B. K. Furman, Michael Gaynes et al. · IEEE Transactions on Components and Packaging Technologies · 2007 · 247 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

John Knickerbocker, Paul Andry, L.P. Buchwalter et al. · IBM Journal of Research and Development · 2005 · 236 citations

Engineering, Computer Engineering, Electrical Engineering +17

3D silicon integration

John Knickerbocker, Paul Andry, B. Dang et al. · 2008 · 225 citations

Engineering, Computer Engineering, Electrical Engineering +17

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias

John Knickerbocker, C.S. Patel, Paul Andry et al. · IEEE Journal of Solid-State Circuits · 2006 · 185 citations

Engineering, Computer Engineering, Electrical Engineering +15

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