Douglas Charles La Tulipe

Three-dimensional integrated circuits

Anna W. Topol, Douglas Charles La Tulipe, D.J. Frank et al. · IBM Journal of Research and Development · 2006 · 701 citations

Engineering, Computer Engineering, Electrical Engineering +17

Wafer-level 3D integration technology

Steven J. Koester, Anthony Young, R. Yu et al. · IBM Journal of Research and Development · 2008 · 177 citations

Engineering, Manufacturing Engineering, Computer-integrated Manufacturing +15

Enabling SOI-based assembly technology for three-dimensional (3d) integrated circuits (ICs)

Anna W. Topol, Douglas Charles La Tulipe, L. Shi et al. · 2006 · 86 citations

Engineering, Manufacturing Engineering, Materials Science +17

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding with sub-300nm Alignment Precision

Aleksandrs Marinins, Sebastian Hänsch, Hüseyin Şar et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2022 · 55 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Thin-film imaging: Past, present, prognosis

David E. Seeger, Douglas Charles La Tulipe, Roderick R. Kunz et al. · IBM Journal of Research and Development · 1997 · 22 citations

Natural Sciences, Electrical Engineering, Materials Science +10