Concepedia

Publication | Open Access

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

DOIFull Paper Access

237

Citations

18

References

2015

Year

Chien-Min Liu, Han-wen Lin, Yi-Sa Huang, Yi‐Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan‐Neng Chen, K. N. Tu
Scientific Reports

References

YearCitations

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