Concepedia

Hsiang‐Yao Hsiao

HH

9

Publications

1.1K

Citations

9

H-Index

2007

Active since

Affiliations

National Yang Ming Chiao Tung University(Current)

University of California, Los Angeles

National Tsing Hua University

Hsiang‐Yao Hsiao is an author at National Yang Ming Chiao Tung University specializing in electronic packaging, materials science, and engineering.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicrostructureApplied PhysicsElectrical EngineeringMicroelectronicsHeat TransferThermodynamicsThermal Engineering

Publications per year

2007–2015

9

Publications

9

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Hsiang‐Yao Hsiao, Chien-Min Liu, Han-wen Lin et al. · Science · 2012 · 376 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

K. N. Tu, Hsiang‐Yao Hsiao, Chih Chen · Microelectronics Reliability · 2012 · 184 citations

Materials Engineering, Materials Science, Microstructure Anisotropy +12

Thermomigration in solder joints

Chih Chen, Hsiang‐Yao Hsiao, Yuan-Wei Chang et al. · Materials Science and Engineering R Reports · 2012 · 157 citations

Materials Science, Friction Welding, Engineering +9

Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition

Tao-Chi Liu, Chien-Min Liu, Hsiang‐Yao Hsiao et al. · Crystal Growth & Design · 2012 · 128 citations

Cu Films, Engineering, Metallic Nanomaterials +19

Thermomigration in Pb-free SnAg solder joint under alternating current stressing

Hsiang‐Yao Hsiao, Chih Chen · Applied Physics Letters · 2009 · 64 citations

Materials Science, Electrical Engineering, Tiny Markers +15

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