Concepedia

Hsiang‐Yao Hsiao

HH

Statistics

Publications

9

Citations

1.1K

H-Index

9

Active since

2007

Affiliations

National Yang Ming Chiao Tung University(Current)

University of California, Los Angeles

National Tsing Hua University

Hsiang‐Yao Hsiao is an author at National Yang Ming Chiao Tung University specializing in materials science, electronic materials, and materials engineering.

Publications per year

2007–2015

9

Publications

9

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Hsiang‐Yao Hsiao, Chien-Min Liu, Han-wen Lin et al. · Science · 2012 · 385 citations

, , +13

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

K. N. Tu, Hsiang‐Yao Hsiao, Chih Chen · Microelectronics Reliability · 2012 · 186 citations

, , +15

Thermomigration in solder joints

Chih Chen, Hsiang‐Yao Hsiao, Yuan-Wei Chang et al. · Materials Science and Engineering R Reports · 2012 · 162 citations

, , +12

Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition

Tao-Chi Liu, Chien-Min Liu, Hsiang‐Yao Hsiao et al. · Crystal Growth & Design · 2012 · 131 citations

, , +13

Thermomigration in Pb-free SnAg solder joint under alternating current stressing

Hsiang‐Yao Hsiao, Chih Chen · Applied Physics Letters · 2009 · 65 citations

, , +17

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