Chih Chen

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Hsiang‐Yao Hsiao, Chien-Min Liu, Han-wen Lin et al. · Science · 2012 · 376 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

Chih Chen, Hua-Ching Tong, K. N. Tu · Annual Review of Materials Research · 2010 · 280 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Chien-Min Liu, Han-wen Lin, Yi-Sa Huang et al. · Scientific Reports · 2015 · 237 citations · Full text

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

K. N. Tu, Hsiang‐Yao Hsiao, Chih Chen · Microelectronics Reliability · 2012 · 184 citations

Materials Engineering, Materials Science, Microstructure Anisotropy +12

Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu, Chih Chen, Chien‐Neng Liao et al. · Applied Physics Letters · 1999 · 159 citations

Materials Engineering, Materials Science, Electrical Engineering +15