Concepedia

M.M.R. Howlader

MH

25

Publications

1.2K

Citations

19

H-Index

1998

Active since

Affiliations

The University of Tokyo(Current)

McMaster University

The University of Texas at Dallas

Toyo Kohan (Japan)

M.M.R. Howlader is an author at The University of Tokyo specializing in engineering, materials science, and applied physics.

Top concepts

EngineeringMaterial ScienceApplied PhysicsSurface ScienceElectronic PackagingElectrical EngineeringMicroelectronicsMicrofabricationMaterials EngineeringCrystalline Defects

Publications per year

1998–2011

25

Publications

25

Room temperature Cu–Cu direct bonding using surface activated bonding method

T. H. Kim, M.M.R. Howlader, Toshihiro Itoh et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2003 · 327 citations

Thin Copper, Engineering, Chemical Deposition +16

Room temperature wafer level glass/glass bonding

M.M.R. Howlader, Satoru Suehara, Tadatomo Suga · Sensors and Actuators A Physical · 2005 · 85 citations

Materials Engineering, Room Temperature, Materials Science +5

Wafer Level Surface Activated Bonding Tool for MEMS Packaging

M.M.R. Howlader, Hironao Okada, Taesoon Kim et al. · Journal of The Electrochemical Society · 2004 · 71 citations

Mems Devices, Engineering, Mechanical Engineering +20

Room-Temperature Microfluidics Packaging Using Sequential Plasma Activation Process

M.M.R. Howlader, Satoru Suehara, Hideki Takagi et al. · IEEE Transactions on Advanced Packaging · 2006 · 64 citations

Materials Science, Advanced Packaging, Room Temperature +15

Room temperature bonding of silicon and lithium niobate

M.M.R. Howlader, Tadatomo Suga, M. J. Kim · Applied Physics Letters · 2006 · 59 citations

Materials Science, Materials Engineering, Electrical Engineering +14

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