Tadatomo Suga

Surface activated bonding of silicon wafers at room temperature

Hideki Takagi, Kenya Kikuchi, Ryutaro Maeda et al. · Applied Physics Letters · 1996 · 441 citations

Engineering, Materials Engineering, Materials Science +13

Room temperature Cu–Cu direct bonding using surface activated bonding method

T. H. Kim, M.M.R. Howlader, Toshihiro Itoh et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 2003 · 335 citations

Natural Sciences, Materials Engineering, Materials Science +15

Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

Zhe Cheng, Fengwen Mu, Luke Yates et al. · ACS Applied Materials & Interfaces · 2020 · 226 citations

Engineering, Materials Engineering, Materials Science +17

Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method

Tadatomo Suga, Yoshihiro Takahashi, Hideki Takagi et al. · Acta Metallurgica et Materialia · 1992 · 225 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effect of Surface Roughness on Room-Temperature Wafer Bonding by Ar Beam Surface Activation

Hideki Takagi, Ryutaro Maeda, Teak Ryong Chung et al. · Japanese Journal of Applied Physics · 1998 · 204 citations

Engineering, Materials Engineering, Materials Science +15