Concepedia

Fengwen Mu

FM

Statistics

Publications

47

Citations

2.1K

H-Index

27

Active since

2010

Affiliations

Chinese Academy of Sciences(Current)

Meisei University

The University of Tokyo

Institute of Microelectronics

University of Chinese Academy of Sciences

Fengwen Mu is an author at Chinese Academy of Sciences specializing in materials science, engineering, and electronic materials.

Publications per year

2010–2024

47

Publications

47

Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

Zhe Cheng, Fengwen Mu, Luke Yates et al. · ACS Applied Materials & Interfaces · 2020 · 226 citations

Engineering, Materials Engineering, Materials Science +17

High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces

Fengwen Mu, Zhe Cheng, Jingjing Shi et al. · ACS Applied Materials & Interfaces · 2019 · 151 citations

Engineering, Electrical Engineering, Materials Science +17

Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices

Fengwen Mu, Ran He, Tadatomo Suga · Scripta Materialia · 2018 · 136 citations

Engineering, Materials Engineering, Materials Science +12

Recent progress in the synthesis of graphene/CNT composites and the energy-related applications

Xin Wu, Fengwen Mu, Haiyan Zhao · Journal of Material Science and Technology · 2019 · 121 citations

Natural Sciences, Materials Engineering, Materials Science +16

Thermal Transport across Ion-Cut Monocrystalline β-Ga<sub>2</sub>O<sub>3</sub> Thin Films and Bonded β-Ga<sub>2</sub>O<sub>3</sub>–SiC Interfaces

Zhe Cheng, Fengwen Mu, Tiangui You et al. · ACS Applied Materials & Interfaces · 2020 · 106 citations

Engineering, Electrical Engineering, Materials Engineering +17

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