Concepedia

Fengwen Mu

FM

Statistics

Publications

45

Citations

1.8K

H-Index

24

Active since

2010

Affiliations

Chinese Academy of Sciences(Current)

The University of Tokyo

Institute of Microelectronics

Meisei University

University of Chinese Academy of Sciences

Fengwen Mu is an author at Chinese Academy of Sciences specializing in engineering, applied physics, and materials science.

ORCID

Top concepts

Publications per year

2010–2024

45

Publications

45

Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices

Zhe Cheng, Fengwen Mu, Luke Yates et al. · ACS Applied Materials & Interfaces · 2020 · 214 citations

High Thermal Boundary Conductance across Bonded Heterogeneous GaN–SiC Interfaces

Fengwen Mu, Zhe Cheng, Jingjing Shi et al. · ACS Applied Materials & Interfaces · 2019 · 145 citations

Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices

Fengwen Mu, Ran He, Tadatomo Suga · Scripta Materialia · 2018 · 126 citations

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Recent progress in the synthesis of graphene/CNT composites and the energy-related applications

Xin Wu, Fengwen Mu, Haiyan Zhao · Journal of Material Science and Technology · 2019 · 119 citations

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Thermal Transport across Ion-Cut Monocrystalline β-Ga<sub>2</sub>O<sub>3</sub> Thin Films and Bonded β-Ga<sub>2</sub>O<sub>3</sub>–SiC Interfaces

Zhe Cheng, Fengwen Mu, Tiangui You et al. · ACS Applied Materials & Interfaces · 2020 · 104 citations

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