Concepedia

Low-temperature Bonding

Low-Temperature Bonding is a wafer bonding technique that belongs to the class of direct bonding methods and is distinguished by its execution at temperatures significantly below 400 °C, enabling minimal thermal budget and compatibility with temperature-sensitive materials and integrated circuit processing.

618

Publications

24.5K

Citations

2.1K

Authors

448

Institutions

Publications per year

2017–2026

169

Parents

Publications

618

SEMICONDUCTOR WAFER BONDING

U. Gösele, Qiaoling Tong · Annual Review of Materials Science · 1998 · 594 citations

, , +17

Adhesive wafer bonding

Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics · 2006 · 463 citations

, , +17

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

Chien-Min Liu, Han-wen Lin, Yi-Sa Huang et al. · Scientific Reports · 2015 · 248 citations · Full text

, , +17

Low temperature bonding of PMMA and COC microfluidic substrates using UV/ozone surface treatment

Chia‐Wen Tsao, Louis P. Hromada, Jianglai Liu et al. · Lab on a Chip · 2007 · 246 citations

, , +17

Plasma-assisted InP-to-Si low temperature wafer bonding

D. M. Pasquariello, Klas Hjort · IEEE Journal of Selected Topics in Quantum Electronics · 2002 · 244 citations

, , +17

1–5 of 618

Authors

2.1K

  1. KC
    Kuan‐Neng Chen

    National Yang Ming Chiao Tung University, Taiwan

    32 publications · 2K citations

    23

    h-index

  2. TS
    Tadatomo Suga

    The University of Tokyo, Japan

    39 publications · 1.4K citations

    23

    h-index

  3. EH
    Eiji Higurashi

    The University of Tokyo, Japan

    17 publications · 516 citations

    15

    h-index

  4. CS
    Chuan Seng Tan

    Nanyang Technological University, Singapore

    19 publications · 714 citations

    14

    h-index

  5. CW
    Chenxi Wang

    Harbin Institute of Technology, China

    14 publications · 641 citations

    14

    h-index

1–5 of 2.1K

Institutions

448

  1. The University of Tokyo

    Tokyo, Japan

    24 h-index

    120 publications

    4.8K citations

  2. National Yang Ming Chiao Tung University

    Hsinchu, Taiwan

    24 h-index

    186 publications

    9.4K citations

  3. Harbin Institute of Technology

    Harbin, China

    19 h-index

    129 publications

    4.5K citations

  4. Nanyang Technological University

    Singapore, Singapore

    17 h-index

    63 publications

    1.6K citations

  5. Max Planck Institute of Microstructure Physics

    Halle, Germany

    15 h-index

    46 publications

    2.7K citations

  6. National Institute of Advanced Industrial Science and Technology

    Tsukuba, Japan

    14 h-index

    58 publications

    1.8K citations

  7. The University of Osaka

    Osaka, Japan

    14 h-index

    75 publications

    3K citations

  8. Chinese Academy of Sciences

    Beijing, China

    13 h-index

    41 publications

    1K citations

1–8 of 448

Venues

  1. Applied Physics Letters

    32 publications · 1.2K citations

    23

    h-index

  2. Journal of Micromechanics and Microengineering

    JMM · 29 publications · 2K citations

    23

    h-index

  3. Sensors and Actuators A Physical

    25 publications · 1.5K citations

    19

    h-index

  4. Japanese Journal of Applied Physics

    JJAP · 20 publications · 523 citations

    15

    h-index

  5. Applied Surface Science

    14 publications · 513 citations

    14

    h-index

1–5