Chuan Seng Tan

Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol

Chuan Seng Tan, D. F. Lim, Shiv Govind Singh et al. · Applied Physics Letters · 2009 · 179 citations

Engineering, Sam Layer, Surface Nanotechnology +19

Morphology and Bond Strength of Copper Wafer Bonding

Kuan‐Neng Chen, Chuan Seng Tan, Andy Fan et al. · Electrochemical and Solid-State Letters · 2003 · 163 citations

Materials Engineering, Materials Science, Electromigration Technique +14

Technology, performance, and computer-aided design of three-dimensional integrated circuits

Shamik Das, Andy Fan, Kuan‐Neng Chen et al. · 2004 · 141 citations

Engineering, Device Integration, Electronic Design +19

Microstructure evolution and abnormal grain growth during copper wafer bonding

Kuan‐Neng Chen, Andy Fan, Chuan Seng Tan et al. · Applied Physics Letters · 2002 · 103 citations

Materials Science, Grain Orientations, Wafer Scale Processing +13

High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 µm

Hao Zhou, Shengqiang Xu, Yiding Lin et al. · Optics Express · 2020 · 102 citations · Full text