Chuan Seng Tan - Concepedia

Author

Chuan Seng Tan

Nanyang Technological University ORCID

Also Known As

C S Tan, C Tan, C. S. Tan, C. S. Tan, C.S Tan, C.S. Tan, CHUAN SENG TAN, Chuan S. Tan, Chuan Seng Tan, Chuan Tan

561

Publications

Citations

H-Index

164

Concepts

All Affiliations

Nanyang Technological University Singapore-MIT Alliance for Research and Technology Massachusetts Institute of Technology Agency for Science, Technology and Research Institute of Microelectronics

About

Chuan Seng Tan is an author at Nanyang Technological University specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	38	141	4.4K
2	Applied Physics	35	123	3.8K
3	Chemistry	12	15	448
4	Chemical Engineering	9	9	308
5	Natural Sciences	5	5	81

Chuan Seng Tan

193

Publications

5.6K

Citations

H-Index

Page 1

	Year	Citations
Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol Chuan Seng Tan, D. F. Lim, Shiv Govind Singh, Applied Physics Letters EngineeringSam LayerSurface NanotechnologyChemistryInterconnect (Integrated Circuits)	2009	179
Morphology and Bond Strength of Copper Wafer Bonding Kuan‐Neng Chen, Chuan Seng Tan, Andy Fan, Electrochemical and Solid-State Letters Materials EngineeringMaterials ScienceElectromigration TechniqueWafer Scale ProcessingEngineering	2003	163
Technology, performance, and computer-aided design of three-dimensional integrated circuits Shamik Das, Andy Fan, Kuan‐Neng Chen, EngineeringDevice IntegrationElectronic DesignComputer ArchitectureComputer-aided Design	2004	141
Microstructure evolution and abnormal grain growth during copper wafer bonding Kuan‐Neng Chen, Andy Fan, Chuan Seng Tan, Applied Physics Letters Materials ScienceGrain OrientationsWafer Scale ProcessingEngineeringSevere Plastic Deformation	2002	103
High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 µm Hao Zhou, Shengqiang Xu, Yiding Lin, Optics Express	2020	102
Online Condition Monitoring System for DC-Link Capacitor in Industrial Power Converters Prasanth Sundararajan, Mohamed Halick Mohamed Sathik, Firman Sasongko, IEEE Transactions on Industry Applications Electrical EngineeringCondition MonitoringReliability EngineeringEngineeringIndustrial Electronics	2018	91
Condition Monitoring of DC-Link Capacitors Using Goertzel Algorithm for Failure Precursor Parameter and Temperature Estimation Prasanth Sundararajan, Mohamed Halick Mohamed Sathik, Firman Sasongko, IEEE Transactions on Power Electronics Electrical EngineeringReliability EngineeringEngineeringCondition MonitoringHardware Reliability	2019	89
Germanium-on-silicon nitride waveguides for mid-infrared integrated photonics Wei Li, P Chandrakasan Anantha, Shuyu Bao, Applied Physics Letters Optical MaterialsEngineeringIntegrated PhotonicsMid-infrared PhotonicsOptoelectronic Devices	2016	82
Silicon Multilayer Stacking Based on Copper Wafer Bonding Chuan Seng Tan, R. Reif Electrochemical and Solid-State Letters Materials ScienceChemical EngineeringWafer Scale ProcessingMultilayer StackEngineering	2005	77
Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology Kuan‐Neng Chen, Andy Fan, Chuan Seng Tan, IEEE Electron Device Letters EngineeringMechanical EngineeringTest StructureInterconnect (Integrated Circuits)Bonded Copper Interconnects	2004	76

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